Provided is an imaging module capable of effectively reducing the size. An image pickup module (2) has a solid-state image sensor (4) having a light-receiving surface (26) on which a light-receiving section (24) is arranged, and a back surface arranged on a second main surface (32) opposite to the light-receiving surface (26) of the solid-state image sensor (4). The hard substrate 10, which is arranged so as to face the electrode 8 and the second main surface 32 of the solid-state imaging device 4 and is electrically connected to the back surface electrode 8, is mounted parallel to the light receiving surface 26. A hard substrate 10 having a surface 44 and a side surface 56 a formed outside the mounting surface 44 when viewed from the thickness direction, the electronic component 14 mounted on the mounting surface 44 of the hard substrate 10, and a side surface of the hard substrate 10. 56a, and the extraction electrode 18 for electrically connecting the wiring cable 20. [Selection diagram] Figure 2【課題】効果的に小型化を図ることができる撮像モジュールを提供する。【解決手段】撮像モジュール２は、受光部２４が配置された受光面２６を有する固体撮像素子４と、固体撮像素子４の受光面２６と反対側の第２の主面３２に配置された裏面電極８と、固体撮像素子４の第２の主面３２に対向して配置され、且つ、裏面電極８と電気的に接続された硬質基板１０であって、受光面２６に対して平行な実装面４４と、厚み方向から見て実装面４４よりも外側に形成された側面５６ａとを有する硬質基板１０と、硬質基板１０の実装面４４に実装された電子部品１４と、硬質基板１０の側面５６ａに配置され、配線ケーブル２０を電気的に接続するための引き出し用電極１８とを備える。【選択図】図２
