An imaging module and an endoscope that have high connection reliability and can be reduced in diameter are provided. An imaging module including an electrical cable, a solid-state imaging device, and a flexible wiring board that electrically connects the solid-state imaging device and the electrical cable is provided. The flexible wiring board 10 includes an element mounting portion 11 for mounting the solid-state imaging device 4, and two rear piece portions 12 and 13 that are bent at both ends of the element mounting portion 11 and extend in a direction away from the element mounting portion 11. And have. A substrate internal space 25 of the flexible wiring substrate 10 surrounded by the element mounting portion 11 and the two rear piece portions 12 and 13 is filled with an adhesive resin R having a glass transition temperature of 135 ° C. or lower. [Selection] Figure 1【課題】接続信頼性が高く、かつ細径化が可能な撮像モジュール及び内視鏡を提供する。【解決手段】電気ケーブル１と、固体撮像素子４と、固体撮像素子４と電気ケーブル１の間を電気的に接続したフレキシブル配線基板１０とを備えた撮像モジュール１００を提供する。フレキシブル配線基板１０は、固体撮像素子４を実装する素子実装部１１と、素子実装部１１の両端部で屈曲されて素子実装部１１から離れる方向に延出された２つの後片部１２、１３とを有する。素子実装部１１と２つの後片部１２、１３で囲まれたフレキシブル配線基板１０の基板内空間２５には、ガラス転移温度が１３５℃以下の接着樹脂Ｒが充填されている。【選択図】図１
