An imaging module and an endoscope apparatus capable of obtaining an image with quality and making a distal end of an insertion unit smaller are to be provided. An imaging module 40 of the present invention includes a solid state image sensor 44, a substrate 45 extending in an optical axis direction of the solid state image sensor 44, and a multi-layer substrate 46 formed on a surface of the substrate 45 and populated with electronic components 55 to 58, where the electronic components 57 and 58 are embedded inside the multi-layer substrate 46, and a transmission path of an image signal and a transmission path of a drive signal are separated on a side of the solid state image sensor 44 due to the electronic components 57 and 58 embedded inside the multi-layer substrate 46 so that the image signal and the drive signal are transmitted through different layers of the substrate 45 the multi-layer substrate 46.
