An imaging module of the invention including a flexible wiring substrate that includes: a first end portion including a connector a second end portion including a mount portion a mounting portion on which an imaging device is mounted a first bend portion bended and provided between the mounting portion and the first end portion and a second bend portion bended and provided between the mounting portion and the second end portion. The first end portion and the second end portion overlap each other at a rear side opposite to an imaging surface of the imaging device, a cable is connected to a surface of the first end portion on the opposite side of the second end portion, and a capacitor is mounted on a surface of the second end portion on the opposite side of the first end portion.
