Each of these wafer-support mounts (7), which are used in a CVD device (1) that forms layers on wafers (W), has a wafer placement surface (7a) in the center of the top surface thereof and a wafer-support section (7b) surrounding same. Each wafer-support section (7b) has the following: vertical wafer-support side surfaces (7b1) that encircle the side surfaces of the wafer placed there; and a surrounding top surface that includes downwardly sloped surfaces (7b2) that slope downwards in the radially outwards direction from the top edges of the wafer-support side surfaces so as to encircle same.
