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THREE DIMENSIONAL PACKAGING FOR MEDICAL IMPLANTS
专利权人:
MEDOS INTERNATIONAL SARL
发明人:
Hogg, Andreas,Tardy, Yanik,Aellen, Thierry,Keppner, Herbert,Burger, Juergen
申请号:
AU2013206095
公开号:
AU2013206095A1
申请日:
2013.05.31
申请国别(地区):
AU
年份:
2014
代理人:
摘要:
#$%^&*AU2013206095A120140109.pdf#####ABSTRACT Implantable medical devices, and methods of coating same, including a plurality of components disposed on a substrate, and a low surface energy layer deposited as a liquid over at least a first portion of the components and the substrate, the low surface energy layer becoming solidified after deposition and conforming to at least the first portion of the components. The devices further include a biocompatible hermetic coating conforming to and sealingly covering at least a portion of the low surface energy layer.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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