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Three dimensional packaging for medical implants
专利权人:
Juergen Burger;Thierry Aellen;Yanik Tardy;Herbert Keppner;Andreas Hogg
发明人:
Andreas Hogg,Yanik Tardy,Thierry Aellen,Herbert Keppner,Juergen Burger
申请号:
US13491081
公开号:
US09345813B2
申请日:
2012.06.07
申请国别(地区):
US
年份:
2016
代理人:
摘要:
Implantable medical devices, and methods of coating same, including a plurality of components disposed on a substrate, and a low surface energy layer deposited as a liquid over at least a first portion of the components and the substrate, the low surface energy layer becoming solidified after deposition and conforming to at least the first portion of the components. The devices further include a biocompatible hermetic coating conforming to and sealingly covering at least a portion of the low surface energy layer.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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