研磨装置、及び研磨方法

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专利权人:

株式会社荏原製作所

发明人:

中西 正行,小寺 健治,谷中 伸拓

申请号：

JP20120284232

公开号：

JP6140439(B2)

申请日:

2012.12.27

申请国别(地区):

日本

年份:

2017

代理人:

摘要：

A polishing apparatus 100 includes a holding stage 4 that holds a central portion of a back surface of a substrate W, a motor M1 that rotates the holding stage 4, a front surface nozzle 36 that feeds a rinse liquid to a front surface of the substrate W, a back surface nozzle 37 that feeds the rinse liquid to a back surface of the substrate W, a rinse liquid control section 110 that feeds the rinse liquid through the back surface nozzle 37 after a preset time elapses since the start of feeding of the rinse liquid through the front surface nozzle 36 and a polishing head assembly 1A that polishes a peripheral portion of the substrate installed on the holding stage 4 after the rinse liquid control section 110 feeds the rinse liquid to the substrate W.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/