John K. Day,Michael J. Nidelkoff,Kris A. Peterson,Andrew J. Ries,David A. Ruben,Craig L. Wiklund
申请号：
US15299941
公开号：
US20170127543A1
申请日:
2016.10.21
申请国别(地区):
US
年份:
2017
代理人:
摘要：
Various embodiments of a sealed package and method of forming such package are disclosed. The package can include a housing having an inner surface and an outer surface, and a substrate having a first major surface and a second major surface. The package can also include an electronic device disposed on the first major surface of the substrate, and a power source disposed at least partially within the housing. The substrate can be sealed to the housing such that a non-bonded electrical connection is formed between a device contact of the electronic device and a power source contact of the power source.
