Andrew J. Thom,Rajesh V. Iyer,Gordon O. Munns,Christian S. Nielsen,Andrew J. Ries
申请号：
US16021177
公开号：
US20200001093A1
申请日:
2018.06.28
申请国别(地区):
US
年份:
2020
代理人:
摘要：
Various embodiments of a hermetically-sealed package and a method of forming such package are disclosed. The package includes a housing that extends along a housing axis between a first end and a second end, where the housing includes first and second opaque portions and a transparent portion disposed between the first and second opaque portions. The first opaque portion is hermetically sealed to a first end of the transparent portion and the second opaque portion is hermetically sealed to a second end of the transparent portion. At least one of the first and second opaque portions is hermetically sealed to the transparent portion by a weld ring. The package further includes a power source disposed within the housing, and an inductive coil disposed at least partially within the transparent portion of the housing and electrically connected to the power source.
