PROBLEM TO BE SOLVED: To provide a vacuum vapor deposition device and a vacuum vapor deposition method, capable of executing, substantially in just proportion, the vapor deposition of a vapor deposition material such as a metallic material on a surface of a vapor deposition target such as a semiconductor wafer.SOLUTION: In a vacuum vapor deposition method by a vacuum vapor deposition device, heated liquid vapor deposition material MT is rotated substantially in the horizontal direction to form a liquid surface MS in a predetermined parabolic surface shape, and by reducing the rotational speed according to the reduction of the amount of the vapor deposition material MT, molecular beams are subjected to flight uniformly with time onto a lower surface of a vapor deposition target SB.
