プリプレグ、積層板、金属箔張積層板、回路基板及びＬＥＤモジュール

• 收藏
• 分享

专利权人:

パナソニックＩＰマネジメント株式会社

发明人:

松田 隆史,古森 清孝,野末 明義,鈴江 隆之,西野 充修,朝日 俊行,谷 直幸,北川 祥与

申请号：

JP20100244145

公开号：

JP6074883(B2)

申请日:

2010.10.29

申请国别(地区):

日本

年份:

2017

代理人:

摘要：

A laminate with superior thermal conductivity, heat resistance, drill workability, and fire retardancy is provided. In a prepreg obtained by impregnating a woven or nonwoven fabric base with a thermosetting resin composition, the thermosetting resin composition contains 80 to 200 parts by volume of an inorganic filler per 100 parts by volume of a thermosetting resin, the inorganic filler contains (A) gibbsite type aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 mum and (B) magnesium oxide having an average particle diameter (D50) of 0.5 to 15 mum, and a compounding ratio (volume ratio) of the gibbsite type aluminum hydroxide particles (A) to the magnesium oxide (B) is 1:0.3 to 3.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/