PROBLEM TO BE SOLVED: To provide a resin composition for electronic circuit board material excellent in moldability, high in glass transition temperature of a cured article, and capable of reducing warpage when manufacturing a semiconductor package.SOLUTION: The invention relates to a resin composition for electronic circuit board material containing (A) a phenol resin, (B) an epoxy resin and (C) an inorganic filler and a curing catalyst. (A) contains a novolak phenol resin having two or more hydroxyl groups in a molecule and a naphthalene skeleton having at least one or more hydroxyl groups of the hydroxyl groups. (B) contains a polyfunctional epoxy resin having two or more epoxy groups in a molecule. The content of (C) is 130 to 250 pts.mass based on 100 pts.mass of the (A) and (B). The curing catalyst is one or more kinds selected from a group of imidazoles, amines, organic phosphines, tetra substituted phosphonium tetra substituted borate and tetraphenyl boron salt. Glass transition temperature (Tg) after
