感光性接着剤組成物、それを用いる半導体装置の製造方法、及び半導体装置

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专利权人:

日立化成株式会社

发明人:

田原 真吾,野部 茂,粕谷 圭,松谷 寛,青木 優,阿部 浩一,谷本 明敏

申请号：

JP20130208851

公开号：

JP6270024(B2)

申请日:

2013.10.04

申请国别(地区):

日本

年份:

2018

代理人:

摘要：

PROBLEM TO BE SOLVED: To provide a photosensitive adhesive composition enabling consecutive pressure-bonding in production of a semiconductor device by lamination of a plurality of semiconductor chips, keeping excellent performance when left on a stage, and having buffer coat characteristics allowing the formation of a thin and high-definition adhesive pattern.SOLUTION: A photosensitive adhesive composition comprises (A) an alkali soluble copolymer resin having a structural unit represented by a specific formula, (B) a compound that generates acid by light, (C) a heat crosslinking agent, and (D) an acrylic resin having a structural unit represented by another specific formula.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/