KASKOUN KENNETH,ZHANG RONGTIAN,NOWAK MATTHEW MICHAEL,GU SHIQUN
申请号：
IN201647041117
公开号：
IN201647041117A
申请日:
2016.12.01
申请国别(地区):
IN
年份:
2017
代理人:
摘要：
An integrated circuit (IC) module with a lead frame micro needle for a medical device and methods of forming the IC module are described. The methods include forming a lead frame blank including a micro needle integrally formed therein. The micro needle may be bent beyond an initial lower side of the lead frame blank. The initial lower side may be joined with a protection layer such that the bent micro needle is embedded in the protection layer which may be removably attached to the initial lower side and the bent micro needle. An IC component may be affixed to an upper side of the lead frame blank. The IC component and an upper surface of a core of the lead frame blank may be encapsulated with a molding compound forming a packaging of the IC module. Removal of the protection layer may expose the bent micro needle projecting away from the packaging.
