KASKOUN, KENNETH,ZHANG, RONGTIAN,NOWAK, MATTHEW MICHAEL,GU, SHIQUN
申请号：
CA2952504
公开号：
CA2952504A1
申请日:
2015.06.04
申请国别(地区):
CA
年份:
2016
代理人:
摘要：
An integrated circuit (IC) module with a lead frame micro-needle for a medical device, and methods of forming the IC module are described. The methods include forming a lead frame blank including a micro-needle integrally formed therein. The micro-needle may be bent beyond an initial lower side of the lead frame blank. The initial lower side may be joined with a protection layer such that the bent micro-needle is embedded in the protection layer, which may be removably attached to the initial lower side and the bent micro-needle. An IC component may be affixed to an upper side of the lead frame blank. The IC component and an upper surface of a core of the lead frame blank may be encapsulated with a molding compound forming a packaging of the IC module. Removal of the protection layer may expose the bent micro-needle projecting away from the packaging.
