PROBLEM TO BE SOLVED: To provide a method for producing a bonded body, which can provide a bonded body comprising adherends adhering mutually with sufficient adhesive strength and with occurrence of voids being suppressed, even when a thickness of an adhesive pattern is 100 μm or more.SOLUTION: Provided is a method for producing a bonded body comprising a first adherend and a second adherend mutually bonded with an adhesive pattern interposed therebetween. The method comprises: a step of disposing a photosensitive adhesive layer including two sheets or more of film-like photosensitive adhesive having a thickness of 5 to 90 μm bonded on the first adherend; a step of forming an adhesive pattern by exposing light and developing the photosensitive adhesive layer; and a step of laminating the second adherend on the adhesive pattern.
