感光性樹脂組成物、感光性フィルム、パターンの形成方法、中空構造の形成方法及び電子部品

• 收藏
• 分享

专利权人:

日立化成株式会社

发明人:

加藤 禎明,菊地 庄吾,橋本 周

申请号：

JP20120221525

公开号：

JP6115065(B2)

申请日:

2012.10.03

申请国别(地区):

日本

年份:

2017

代理人:

摘要：

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which has excellent moisture heat resistance and gives a cured product having a high elastic modulus and superior holding property for a hollow structure, and which is suitably used as a cap material to form a hollow structure in an electronic component or the like.SOLUTION: The photosensitive resin composition comprises: a photopolymerizable compound (A) including a urethane compound (A1) having at least one of an acryloyl group and a methacryloyl group; and a photopolymerization initiator (B).

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/