PROBLEM TO BE SOLVED: To provide a vapor deposition apparatus for suppressing material deterioration in the deposition of a thin-film material so that a stable film thickness can be obtained at a desired vapor deposition rate.SOLUTION: A vapor deposition apparatus disposes a base material in a vacuum chamber so that a thin film material contained in a material gas fed from a material gas feed mechanism may be filmed on the base material. The material gas feed mechanism includes a vaporization part connected to an aerosol feed mechanism, and the material gas contains the vapor of the thin film material, in which the powder fed in the vaporization part from the aerosol feeding mechanism contained in the aerosol fed from the aerosol feed mechanism is gasified. The aerosol feeding mechanism includes: a powder separation part for separating the powder from the aerosol; a powder storage part for storing the powder separated and recovered; and an aerosol forming part for forming the aerosol from the powder fed from
