To provide an imaging unit capable of improving connection reliability between an imaging device and a substrate, while aiming at miniaturization and provide an endoscope.SOLUTION: An imaging unit includes: an imaging device 11 having a light-receiving surface on a surface f, and a connection electrode on a rear f； a circuit board 20 constituted by laminating a plurality of substrates in the orthogonal state to the light-receiving surface of the imaging device 11, in which a plurality of circular connection lands for connecting the connection electrode of the imaging device 11 are formed on the end of internal wiring exposed to a first side face fwhich is a face formed by laminating side faces of the substrates； and an electronic component 50 mounted on the circuit board 20.SELECTED DRAWING: Figure 2【課題】小型化を図りながら、撮像素子と基板との接続信頼性を向上しうる撮像ユニットおよび内視鏡を提供する。【解決手段】本発明における撮像ユニットは、表面ｆ１に受光面を有し、背面ｆ２に接続電極を有した撮像素子１１と、複数の基板が撮像素子１１の受光面と直交した状態で積層されて構成され、基板の側面が積層されてなる面である第１の側面ｆ３に露出する内部配線の端部の上に撮像素子１１の接続電極を接続する複数の円形の接続ランドが形成されている回路基板２０と、回路基板２０に実装されている電子部品５０と、を備える。【選択図】図２
