PROBLEM TO BE SOLVED: To provide an endoscope that can sufficiently secure the strength of connection between a solid state imaging device and a circuit board.SOLUTION: An endoscope includes an imaging device 20A at a tip 10 of an insertion part 6 inserted into a body cavity. The imaging device 20A includes an image sensor 23 that subjects a photography light incident on an image receiving surface through an imaging lens in a barrel 21 to photoelectric conversion, and a circuit board 24 having a connection surface 25a facing a terminal surface 23a which is a surface opposite to the image receiving surface of the image sensor 23. A plurality of terminals 31 are arranged equally in a two-dimensional matrix shape both vertically and laterally on the terminal surface 23a of the image sensor 23. The connection surface 25a of the circuit board 24 and the terminal surface 23a of the image sensor 23 are connected to each other through the plurality of terminals 31. The gross area of the plurality of terminals 31 accounts for 10% or more of the terminal surface 23a.SELECTED DRAWING: Figure 2【課題】固体撮像素子と回路基板との接続強度を十分に確保可能な内視鏡を提供すること。【解決手段】内視鏡は、体腔内に挿入される挿入部６の先端部１０に撮像装置２０Ａを備える。撮像装置２０Ａは、鏡筒２１内の撮影レンズを介して受像面に入射された撮影光を光電変換するイメージセンサ２３と、イメージセンサ２３の受像面とは反対側の面である端子面２３ａに対向する接続面２５ａを有する回路基板２４とを有する。イメージセンサ２３の端子面２３ａには、複数の端子３１が二次元のマトリクス状に縦にも横にも均等に配置され、回路基板２４の接続面２５ａとイメージセンサ２３の端子面２３ａとは、複数の端子３１を介して接続される。端子面２３ａに対する複数の端子３１の総面積は１０％以上を占める。【選択図】図２
