PROBLEM TO BE SOLVED: To provide an endoscope imaging apparatus which increases the durability of both of the connections between an image sensor and a circuit board and between the circuit board and cables, and to realize miniaturization of the apparatus.SOLUTION: An imaging apparatus 20 includes: an image sensor 21 disposed with an image receiving surface thereof intersecting a longitudinal axis A of an insertion unit； and a circuit board 24 with the image sensor 21 mounted thereon. The circuit board 24 includes: plural sensor connection lands for respectively connecting the pins of the image sensor 21； a sensor mounting portion 30 overlying a back surface opposite the image receiving surface of the image sensor 21； plural wire connection lands； and a polygonal columnar wire connection portion 31 disposed along the longitudinal axis A. An outline of the wire connection portion 31 is smaller than an outline of the sensor mounting portion 30 when viewed in the axial direction of the wire connection portion 31. The wire connection lands are arranged on plural side surfaces of the wire connection portion 31 in a distributed manner.SELECTED DRAWING: Figure 3【課題】イメージセンサと回路基板との接続、及び回路基板と電線との接続における耐久性をいずれも高め、且つ小型化を図った内視鏡用撮像装置を提供する。【解決手段】内視鏡用撮像装置２０は、受像面が挿入部の長手軸Ａに交差して配置されるイメージセンサ２１と、イメージセンサ２１が実装される回路基板２４と、を備え、回路基板２４は、イメージセンサ２１の端子がそれぞれ接続される複数のセンサ接続ランドを含み、イメージセンサ２１の受像面とは反対側の背面に重ねられたセンサ実装部３０と、複数の電線接続ランドを含み、長手軸Ａに沿って配置される多角柱状の電線接続部３１と、を有し、電線接続部３１の軸方向にみた場合に電線接続部３１の外形はセンサ実装部３０の外形より小さく、電線接続ランドは電線接続部３１の複数の側面に分散して設けられている。【選択図】図３
