Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides
Rohm and Haas Electronic Materials LLC;Dow Global Technologies LLC
发明人:
Thorseth Matthew,Niazimbetova Zuhra,Qin Yi,Woertink Julia,Dziewiszek Joanna,Reddington Erik,Lefebvre Mark
申请号：
US201615220472
公开号：
US9932684(B2)
申请日:
2016.07.27
申请国别(地区):
美国
年份:
2018
代理人:
Piskorski John J.
摘要：
Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of α-amino acids and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
