Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds
Dow Global Technologies LLC;Rohm and Haas Electronic Materials LLC
发明人:
Thorseth Matthew,Niazimbetova Zuhra,Qin Yi,Woertink Julia,Dziewiszek Joanna,Reddington Erik,Lefebvre Mark
申请号：
US201615220467
公开号：
US10100421(B2)
申请日:
2016.07.27
申请国别(地区):
美国
年份:
2018
代理人:
Piskorski John J.
摘要：
Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
