METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF ALPHA AMINO ACIDS AND BISEPOXIDES

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专利权人:

Rohm and Haas Electronic Materials LLC;Dow Global Technologies LLC

发明人:

THORSETH, Matthew,ZUHRA, Niazimbetova,QIN, Yi,WOERTINK, Julia,DZIEWISZEK, Joanna,REDDINGTON, Erik,LEFEBVRE, Mark

申请号：

EP20160182479

公开号：

EP3128043(B1)

申请日:

2016.08.02

申请国别(地区):

欧洲专利局

年份:

2018

代理人:

摘要：

Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of ±-amino acids and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

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