METHOD OF ELECTROPLATING COPPER INTO A VIA ON A SUBSTRATE FROM AN ACID COPPER ELECTROPLATING BATH

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专利权人:

Rohm and Haas Electronic Materials LLC

发明人:

THORSETH, Matthew,SCALISI, Mark,CIULLO, Corey

申请号：

EP20160193170

公开号：

EP3162921(B1)

申请日:

2016.10.10

申请国别(地区):

欧洲专利局

年份:

2018

代理人:

摘要：

Copper electroplating baths containing primary alcohol alkoxylate block copolymers and ethylene oxide/propylene oxide random copolymers having specific HLB ranges are suitable for filling vias with copper, where such copper deposits are substantially void-free and substantially free of surface defects.

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中国工程科技知识中心

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