COPPER ELECTROPLATING BATHS AND ELECTROPLATING METHODS CAPABLE OF ELECTROPLATING MEGASIZED PHOTORESIST DEFINED FEATURES

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专利权人:

Rohm and Haas Electronic Materials LLC

发明人:

THORSETH, Matthew,HAZEBROUCK, Rebecca,SCALISI, Mark,NIAZIMBETOVA, Zuhra,DZIEWISZEK, Joanna

申请号：

EP20170163063

公开号：

EP3225719(B1)

申请日:

2017.03.27

申请国别(地区):

欧洲专利局

年份:

2018

代理人:

摘要：

Copper electroplating baths and methods enable the plating of photoresist defined megafeatures at high current densities which have substantially uniform morphology and reduced nodule development. The copper electroplating baths include a mixture of heterocyclic nitrogen containing copolymers which provide megafeatures having a good %TIR and %WID balance.

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