シアン酸エステル樹脂、硬化性樹脂組成物、その硬化物、プリプレグ、回路基板、半導体封止材料、及びビルドアップフィルム

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专利权人:

ＤＩＣ株式会社

发明人:

長江 教夫,佐藤 泰

申请号：

JP20130062041

公开号：

JP6111776(B2)

申请日:

2013.03.25

申请国别(地区):

日本

年份:

2017

代理人:

摘要：

PROBLEM TO BE SOLVED: To provide a curable resin composition whose cured product has both excellent heat resistance and excellent dielectric characteristics, a cured product thereof, a prepreg, a circuit board, a semiconductor sealing material, a build-up film, and a cyanate ester resin which gives these properties.SOLUTION: The cyanate ester resin contains a trifunctional compound (x) represented by the structural formula (1) (wherein Rand Reach independently represents a hydrogen atom, a C1-C4 alkyl group, or a C1-C4 alkoxy group).

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/