PROBLEM TO BE SOLVED: To provide an imaging unit and an endoscope, for improving connection strength between boards, retaining package density, and having a diameter capable of being thinned.SOLUTION: An imaging unit 10 comprises: a semiconductor package 20 having a front face on which an imaging element 21 is formed and a rear face on which a plurality of connection lands are formed a flat circuit board 30 having a front face on which a plurality of first connection electrodes individually connected to the plurality of connection lands are formed and a rear face on which a plurality of second connection electrodes are formed and an irregular shape circuit board 40 on which a plurality of third connection electrodes individually connected to the plurality of the second connection electrodes are formed. The flat circuit board 30 and the irregular shape circuit board 40 have a shape included inside the semiconductor package 20s projection plane in the imaging element 21s optical axis direction. The third connection electrodes are arranged at positions opposite to the second connection electrodes and have a nonplanar conductive pattern the second connection electrodes and the third connection electrodes are connected using solder.SELECTED DRAWING: Figure 2COPYRIGHT: (C)2017,JPO&INPIT【課題】基板間の接続強度を向上するとともに、実装密度を保持し細径化が可能な撮像ユニットおよび内視鏡を提供する。【解決手段】本発明における撮像ユニット10は、表面に形成された撮像素子21と、裏面に形成された複数の接続ランドと、を有する半導体パッケージ20と、表面に前記複数の接続ランドとそれぞれ接続される複数の第1の接続電極が形成されるとともに、裏面に複数の第2の接続電極が形成される平面回路基板30と、前記複数の第2の接続電極とそれぞれ接続される複数の第3の接続電極が形成される異形回路基板40と、を備え、平面回路基板30および異形回路基板40は、撮像素子21の光軸方向における半導体パッケージ20の投影面内に収まる形状をなし、前記第3の接続電極は、前記第2の接続電極と対向する位置に配置される非平面状の導電パターンであり、前記第2の接続電極と前記第3の接続電極ははんだ接続されることを特徴とする。【選択図】図2
