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半導体素子、半導体素子の製造方法
专利权人:
三菱電機株式会社
发明人:
前田 和弘,志賀 俊彦
申请号:
JP20130091548
公开号:
JP6111818(B2)
申请日:
2013.04.24
申请国别(地区):
日本
年份:
2017
代理人:
摘要:
A semiconductor device includes a substrate having a hexagonal crystalline structure and a (0001) surface, and conductive films on the surface of the substrate. The conductive films include a first conductive film and a second conductive film located above the first conductive film with respect to the surface, wherein the first conductive film has a crystalline structure which does not have a plane that has a symmetry equivalent to the symmetry of atomic arrangement in the surface of the substrate, the second conductive film has a crystalline structure having at least one plane that has a symmetry equivalent to the symmetry of atomic arrangement in the surface of the substrate, and the second conductive film is polycrystalline and has a grain size no larger than 15 μm.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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