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Cardboard-Box-Free Packaging Of Solid Yeast Products
专利权人:
Jean-Pierre Chassard
发明人:
Jean-Pierre Chassard,Stéphane Lacroix,Bernard Stadler,Sophie Schneider
申请号:
US13495354
公开号:
US20130004624A1
申请日:
2012.06.13
申请国别(地区):
US
年份:
2013
代理人:
摘要:
The invention relates to packaging (10) for solid yeast products, such as: a supporting element (12) solid yeast products contained in one or more packages (22), supported by the supporting element (12) and an outer cover (14) retaining all of the solid yeast products contained in the packages (22) on the supporting element (12). According to the invention, all of the packages (22) located between the solid yeast products and the outer cover (14) may have a surface density no greater than 200 g/m2. The invention also relates to a method for packaging solid yeast products and to a method for preserving and using solid yeast products thus packaged.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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