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物理的気相成長法による窒化アルミニウムの緩衝及び活性層
专利权人:
アプライド マテリアルズ インコーポレイテッドAPPLIED MATERIALS,INCORPORATED
发明人:
チュー, ミンウェイ,パティバンドラ, ナグ ビー.,ワン, ロンジュン,アグラワル, ヴィヴェク,スブラマニ, アナンタ,ディール, ダニエル エル.,タン, シャンミン
申请号:
JP20150520613
公开号:
JP6272850(B2)
申请日:
2013.07.01
申请国别(地区):
日本
年份:
2018
代理人:
摘要:
Embodiments of the invention described herein generally relate to an apparatus and methods for forming high quality buffer layers and Group III-V layers that are used to form a useful semiconductor device, such as a power device, light emitting diode (LED), laser diode (LD) or other useful device. Embodiments of the invention may also include an apparatus and methods for forming high quality buffer layers, Group III-V layers and electrode layers that are used to form a useful semiconductor device. In some embodiments, an apparatus and method includes the use of one or more cluster tools having one or more physical vapor deposition (PVD) chambers that are adapted to deposit a high quality aluminum nitride (AlN) buffer layer that has a high crystalline orientation on a surface of a plurality of substrates at the same time.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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