An image pickup apparatus includes: a wiring board that has a first main surface and a second main surface； an electronic components that include an image pickup device mounted on the wiring board； and conductive wires bonded to the wiring board. The wiring board includes a first area disposed in an XY plane, a second area extended from a distal end portion of the first area and disposed in an XZ plane, a third area extended from a first side surface of the first area and disposed in a YZ plane, and a fourth area extended from a distal end portion of the third area and disposed in the XZ plane. The first main surface of the second area is a distal end surface, and the image pickup device is mounted on the distal end surface.
