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WIRING BOARD, METHOD FOR MANUFACTURING WIRING BOARD, AND IMAGE PICKUP DEVICE
专利权人:
发明人:
申请号:
EP11860278.8
公开号:
EP2683225A1
申请日:
2011.12.12
申请国别(地区):
EP
年份:
2014
代理人:
摘要:
A wiring board 10 includes a plurality of wiring layers 22, a plurality of insulating layers 23, and an electrode member 20 made of a conductive material, the electrode member 20 being incorporated in the wiring board 10 in a state in which the electrode member 20 includes exposed sections 20S on side surfaces 13 and 14 that cross the plurality of wiring layers 22 and the plurality of insulating layers 23.
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