An endoscope includes an image pickup module, and the image pickup module includes: an image pickup device an external electrode being disposed on a back surface of the image pickup device； a wiring element provided with a through-hole passing through a first main surface and a second main surface, a first electrode on the first main surface being bonded with the external electrode； a signal cable bonded with a second electrode on the second main surface of the wiring element； and a first resin that seals a first bump bonding the first electrode and the external electrode and a second bump bonding the second electrode and the signal cable, and fills the through-hole.
