An image pickup unit for endoscope of the invention includes: an image pickup device including on a front face a plurality of electrode pads aligned along one side face and a circuit substrate having an end face from which a lead group, a distal end portion of which is bonded to the plurality of electrode pads, is extended, wherein the end face of the circuit substrate is disposed more rearward than a rear face of the image pickup device, the lead group includes a first lead constituted of at least one of a lead connected to an image pickup device reference electric potential and a dummy lead which does not include an electrical function, and another second lead, and the first lead is closer to the edge portion where the rear face and the side face of the image pickup device intersect than the second lead is.
