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Wiring board, manufacturing method for wiring board, and image pickup apparatus
专利权人:
发明人:
Noriyuki Fujimori
申请号:
US14017849
公开号:
US09693460B2
申请日:
2013.09.04
申请国别(地区):
US
年份:
2017
代理人:
摘要:
A wiring board includes a plurality of wiring layers, a plurality of insulating layers, and an electrode member made of a conductive material, the electrode member being incorporated in the wiring board in a state in which the electrode member includes exposed sections on side surfaces that cross the plurality of wiring layers and the plurality of insulating layers.
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