Wiring board, manufacturing method for wiring board, and image pickup apparatus

• 收藏
• 分享

专利权人:

发明人:

Noriyuki Fujimori

申请号：

US14017849

公开号：

US09693460B2

申请日:

2013.09.04

申请国别(地区):

US

年份:

2017

代理人:

摘要：

A wiring board includes a plurality of wiring layers, a plurality of insulating layers, and an electrode member made of a conductive material, the electrode member being incorporated in the wiring board in a state in which the electrode member includes exposed sections on side surfaces that cross the plurality of wiring layers and the plurality of insulating layers.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/