An imaging unit includes: an image sensor having an electrode pad and a light-receiving surface； a flexible printed circuit board having an inner lead connected to the electrode pad and extending from the image sensor in a direction opposite to where the light-receiving surface is provided； and one or more electronic components mounted on a first surface of the flexible printed circuit board, the first surface being on a side where the image sensor is provided. The flexible printed circuit board includes: an insulating base material； a first wiring layer on the base material on a side of the first surface； a first film for insulating the first wiring layer； a second wiring layer on the base material on a side of a second surface opposite to the first surface； and a second film for insulating the second wiring layer. The inner lead extends from the first wiring layer.
