A device includes a neural interface and a lead body. The lead body includes a bulk conductor and the neural interface includes a flexible circuit. The flexible circuit includes a microfabricated substrate and an exposed electrode. An interconnect region disposed between the electrode and the bulk conductor provides electrical connection between the electrode and the bulk conductor such that electrical signals can be communicated relative to the electrode via the bulk conductor. The interconnect region can be respectively connected to the electrode and bulk conductor by wire-bonding, welding, or other suitable connection methods.
