An endoscope 2 is an endoscope 2 in which an image pickup apparatus 1 is placed in a distal end portion 2a of an insertion portion, the image pickup apparatus 1 including an image pickup device 10 including a semiconductor substrate 11 in which an image pickup section 13 is formed on a first principal surface 10SA, the semiconductor substrate 11 including a bonding terminal 18 on a second principal surface 10SB, and a wiring layer 12 that is placed on the first principal surface 10SA of the semiconductor substrate 11 and includes a conductor layer 12A stacked via insulating layers 12B and 12C, and a cover glass 30 that is bonded in such a manner as to cover an entire side of the first principal surface of the image pickup device 10, the endoscope 2 including a protection section 40 configured to cover at least a side surface of the wiring layer 12 of the image pickup device 10, the protection section 40 including a resin 41 in which blocking particles 42 are dispersed, the blocking particles 42 having lower moisture permeability than moisture permeability of the resin 41.
