PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition suitable for obtaining a projection pattern of SiO, that is, the resin composition having good development adhesiveness during development and capable of maintaining a fine pattern without causing reflow after baking.SOLUTION: The positive photosensitive resin composition comprises: (a) a polysiloxane synthesized by hydrolyzing and condensing organosilane containing a silane compound expressed by general formula (1) described below and a silane compound expressed by general formula (2) described below; (b) a naphthoquinone diazide compound; and (c) a solvent.
