Problem to be solved: to provide an imaging module capable of improving the durability of a semiconductor chip on which an image pickup device is formed, an endoscope having this imaging module, and an endoscope apparatus having this endoscope.The imaging module 40 has a flexible substrate 60 having an opening 60b facing the prism 47, and an image pickup element 51 arranged in a state parallel to the longitudinal direction X of the insertion part 10, and the imaging surface 51A is disposed facing the opening 60b and is placed on the opening A semiconductor chip 50 electrically connected to the rebable substrate 60 and a frame shaped reinforcing member disposed on the outer periphery of the semiconductor chip 50 to reinforce the semiconductor chip 50, and the inner peripheral surface of the semiconductor chipA reinforcing member 70 adhered to the entire outer peripheral surface is provided.Diagram【課題】撮像素子が形成された半導体チップの耐久性を向上させることのできる撮像モジュール、この撮像モジュールを備える内視鏡、及びこの内視鏡を備える内視鏡装置を提供する。【解決手段】撮像モジュール40は、プリズム47に対面する開口部60bを有するフレキシブル基板60と、撮像面51aが挿入部10の長手方向Xに平行な状態で配置される撮像素子51を有し、撮像面51aが開口部60bに向いた状態で配置されてフレキシブル基板60と電気的に接続された半導体チップ50と、半導体チップ50の外周に配置されて半導体チップ50を補強する枠状の補強部材であって、内周面が半導体チップ50の外周面の全体に接着された補強部材70と、を備える。【選択図】図2
