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エポキシ基含有ケイ素化合物及び熱硬化性樹脂組成物
专利权人:
日本化薬株式会社
发明人:
中山 幸治
申请号:
JP20110118684
公开号:
JP6116040(B2)
申请日:
2011.05.27
申请国别(地区):
日本
年份:
2017
代理人:
摘要:
The present invention relates to an epoxy group-containing silicon compound which is obtained by condensing at least one epoxy group-containing alkoxy silicon compound per se represented by the general formula (1a): R1aSi(OR2)3, wherein R1a denotes a substituent having an epoxy group and R2 denotes an alkyl group having at most 4 carbons, or said compound and at least one substituted alkoxy silicon compound represented by the general formula (1b): R1bSi(OR3)3, wherein R1b denotes an alkyl group having at most 10 carbons, an aryl group or an unsaturated aliphatic residue and R3 denotes an alkyl group having at most 4 carbons, in the presence of a basic catalyst.
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