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IMAGING DEVICE, METHOD FOR MANUFACTURING IMAGING DEVICE, AND ENDOSCOPE DEVICE
专利权人:
FUJIFILM CORP;富士フイルム株式会社
发明人:
TAKAHASHI KAZUAKI,▲高▼橋 一昭,ISHII SHUICHI,石井 秀一,YANO TAKASHI,矢野 孝,OTA YASUYOSHI,大田 恭義,SUZUKI KAZUMASA,鈴木 一誠
申请号:
JP2017119473
公开号:
JP2017192752A
申请日:
2017.06.19
申请国别(地区):
JP
年份:
2017
代理人:
摘要:
PROBLEM TO BE SOLVED: To provide an imaging device which can be miniaturized and whose manufacturing process can be made efficient, a method for manufacturing an imaging device, and an endoscope device.SOLUTION: An imaging device 10 includes: an image pick-up device 11; an objective optical system 12 including an optical element 21 adjoining the image pick-up device 11 that bends an incident optical path extending in a direction intersecting with a normal line direction of an image receiving surface of the image pick-up device 11 in the normal line direction by the optical element 21; a rigid circuit board part 13, part 13a of which is arranged overlapping with the optical element 21 in the normal direction on the side opposite to the image pick-up device 11; and a connection board part 14 that connects the image pick-up device 11 and the circuit board part 13. A section 14a between the image pick-up device 11 and the circuit board part 13 in the connection board part 14 is flexible.SELECTED DRAWING: Figure 2【課題】小型化可能で且つ製造工程を効率化可能な撮像装置及び撮像装置の製造方法並びに内視鏡装置を提供する。【解決手段】撮像装置10は、撮像素子11と、撮像素子11に隣設された光学素子21を含み、撮像素子11の受像面の法線方向と交差する方向に延びる入射光路を光学素子21によって法線方向に屈曲させる対物光学系12と、一部13aが上記法線方向に撮像素子11とは反対側で光学素子21に重なって配置されているリジッドな回路基板部13と、撮像素子11と回路基板部13とを連結している連結基板部14と、を備え、連結基板部14における撮像素子11と回路基板部13との間の区間14aはフレキシブルである。【選択図】図2
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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