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Optical measurement of opening dimensions in a wafer
专利权人:
KLA-TENCOR CORPORATION
发明人:
Xu James Jianguo,Soetarman Ronny,Lee Ken Kinsun,Kathuria Nitigya
申请号:
US201615338838
公开号:
US10157457(B2)
申请日:
2016.10.31
申请国别(地区):
美国
年份:
2018
代理人:
Imperium Patent Works LLP `Marrello Mark D.
摘要:
A method of generating 3D information of a sample using an optical microscope includes: varying the distance between the sample and an objective lens of the optical microscope at pre-determined steps, capturing an image at each pre-determined step, determining a characteristic value of each pixel in each captured image, determining a first captured image that is focused on a first surface of the sample based on the characteristic value of each pixel in each captured image, and determining a measurement of an opening in the first surface of the sample based on the first captured image. The first surface of the sample and the second surface of the sample are within a field of view of each of the captured images. The first captured image includes a pattern overlay. In another example, the opening measurement is determined using a second captured image without a pattern overlay.
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中国工程科技知识中心
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http://www.ckcest.cn/home/

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