PROBLEM TO BE SOLVED: To provide a device comprising at least one module configured to form such a predetermined pattern on an insulative planar substrate as to collect conductive particles in accordance with that pattern, a method, the insulative planar substrate and a chipset.SOLUTION: At least different one module is configured to transfer conductive particles to the insulative planar substrate and disposed to collect the conductive particles in accordance with the predetermined pattern. A sinter module is configured to fuse the conductive particles on the insulative planar substrate and disposed to form a conductive plane on the insulative planar substrate by fusing the conductive particles in accordance with the predetermined pattern. The embodiment of the present invention relates to printable electronics or printing electronics on a fiber web.