Rohm and Haas Electronic Materials CMP Holdings, Inc. ;Dow Global Technologies LLC
发明人:
Qian Bainian,Jacob George C.,Wank Andrew,Shidner David,Reddy Kancharla-Arun K.,Alden Donna Marie,DeGroot Marty W.
申请号：
US201715583037
公开号：
US2018311792(A1)
申请日:
2017.05.01
申请国别(地区):
美国
年份:
2018
代理人:
摘要：
The present invention provides methods of manufacturing a chemical mechanical polishing (CMP polishing) layer for polishing substrates, such as semiconductor wafers comprising providing a composition of a plurality of liquid-filled microelements having a polymeric shell; classifying the composition via centrifugal air classification to remove fines and coarse particles and to produce liquid-filled microelements having a density of 800 to 1500 g/liter; and, forming the CMP polishing layer by (i) converting the classified liquid-filled microelements into gas-filled microelements by heating them, then mixing them with a liquid polymer matrix forming material and casting or molding the resulting mixture to form a polymeric pad matrix, or (ii) combining the classified liquid-filled microelements directly with the liquid polymer matrix forming material, and casting or molding.
