Improved chemical mechanical polishing pad and methods of making and using same

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专利权人:

Rohm and Haas Electronic Materials CMP Holdings, Inc.

发明人:

Hreha, Richard D.,Palaparthi, Ravichandra V.,Vining, Benjamin John

申请号：

EP20080162346

公开号：

EP2025454(B1)

申请日:

2008.08.14

申请国别(地区):

欧洲专利局

年份:

2018

代理人:

摘要：

Shape memory chemical mechanical polishing pads are provided, wherein the shape memory chemical mechanical polishing pads comprise a polishing layer in a densified state. Also provided are methods of making the shape memory chemical mechanical polishing pads and for using them to polish substrates.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/