Rohm and Haas Electronics Materials CMP Holdings, Inc.;Dow Global Technologies LLC
发明人:
Veneziale David Michael,Qian Bainian,Brugarolas Brufau Teresa,Kozhukh Julia,Tong Yuhua,Miller Jeffrey B.,Lugo Diego,Jacob George C.,DeGroot Marty W.,Wank Andrew,Yeh Fengji
申请号：
US201514751423
公开号：
US10105825(B2)
申请日:
2015.06.26
申请国别(地区):
美国
年份:
2018
代理人:
Delbert Thomas S.`Merriam Andrew`Biederman Blake T.
摘要：
A method of forming a chemical mechanical polishing pad polishing layer is provided, including: providing a mold having a base with a negative of a groove pattern; providing a poly side (P) liquid component; providing an iso side (I) liquid component; providing a pressurized gas; providing an axial mixing device; introducing the poly side (P) liquid component, the iso side (I) liquid component and the pressurized gas to the axial mixing device to form a combination; discharging the combination from the axial mixing device at a velocity of 10 to 300 m/sec toward the base; allowing the combination to solidify into a cake; deriving the chemical mechanical polishing pad polishing layer from the cake; wherein the chemical mechanical polishing pad polishing layer has a polishing surface with the groove pattern formed into the polishing surface; and wherein the polishing surface is adapted for polishing a substrate.
