Rohm and Haas Electronic Materials CMP Holdings, Inc.;Dow Global Technologies LLC
发明人:
Qian Bainian,Brugarolas Brufau Teresa,Kozhukh Julia,Veneziale David Michael,Tong Yuhua,Lugo Diego,Jacob George C.,Miller Jeffrey B.,Tran Tony Quan,Stack Marc R.,Wank Andrew,Hendron Jeffrey James
申请号：
US201615163184
公开号：
US10092998(B2)
申请日:
2016.05.24
申请国别(地区):
美国
年份:
2018
代理人:
Deibert Thomas S.`Merriam Andrew`Biederman Blake T.
摘要：
A method of forming a chemical mechanical polishing pad composite polishing layer is provided, including: providing a first polishing layer component of a first continuous non-fugitive polymeric phase having a plurality of periodic recesses; discharging a combination toward the first polishing layer component at a velocity of 5 to 1,000 m/sec, filling the plurality of periodic recesses with the combination; allowing the combination to solidify in the plurality of periodic recesses forming a second non-fugitive polymeric phase giving a composite structure; and, deriving the chemical mechanical polishing pad composite polishing layer from the composite structure, wherein the chemical mechanical polishing pad composite polishing layer has a polishing surface on the polishing side of the first polishing layer component; and wherein the polishing surface is adapted for polishing a substrate.
